Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LQFP
External dimensions/packaging: LQFP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Integrated Device Technology | 功能相似 | LQFP |
SRAM chip sync dual 5V 64KB TQFP64
|
||
IDT7005S20PF8
|
Integrated Device Technology | 功能相似 | LQFP |
IC SRAM 64Kbit 20NS 64TQFP
|
||
IDT70V05L20PFI
|
Integrated Device Technology | 功能相似 | LQFP |
高速3.3V 8K ×8双端口静态RAM HIGH-SPEED 3.3V 8K x 8 DUAL-PORT STATIC RAM
|
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