Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
7202LA20DB
|
Integrated Device Technology | 功能相似 | CDIP-28 |
先进先出 1024 X 9 BIT CMOS PARALLEL
|
||
|
|
Integrated Device Technology | 功能相似 | CDIP-28 |
FIFO, 1KX9, 20ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28
|
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