Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN74ALVC16835DGGR
|
TI | 功能相似 | TSSOP-56 |
18位通用总线驱动器,具有三态输出 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS
|
||
SN74ALVCH16835DGG
|
TI | 功能相似 | TSSOP |
18位通用总线驱动器,具有三态输出 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS
|
||
SN74ALVCH16835DGGR
|
TI | 功能相似 | TSSOP-56 |
18位通用总线驱动器,具有三态输出 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS
|
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