Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74ALVCH16373DGGRG4
|
TI | 功能相似 | TSSOP-48 |
16位透明D类锁存器具有三态输出 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS
|
||
SN74ALVCH16373DGGR
|
TI | 功能相似 | TSSOP-48 |
TEXAS INSTRUMENTS SN74ALVCH16373DGGR 芯片, 16位, D型锁存器, 三态, TSSOP-48
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