Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74ABT16541ADGGRE4
|
TI | 功能相似 | TSSOP-48 |
16位缓冲器/驱动器,具有三态输出 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS
|
||
74ABT16541ADGGRG4
|
TI | 功能相似 | TSSOP-48 |
16位缓冲器/驱动器,具有三态输出 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS
|
||
SN74ABT16541ADGGR
|
TI | 功能相似 | TSSOP-48 |
16位缓冲器/驱动器,具有三态输出 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review