Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SSOP
External dimensions/packaging: SSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY74FCT162827ATPVC
|
TI | 功能相似 | SSOP-56 |
20位缓冲器/线路驱动器 20-Bit Buffers/Line Drivers
|
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