Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-16
External dimensions/packaging: SOIC-16
Other/Product Lifecycle: Supply in progress
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLC5916-Q1
|
TI | 功能相似 | SOIC-16 |
汽车类 8 位恒流 LED 灌电流驱动器
|
||
TPIC6C596
|
TI | 功能相似 |
汽车类 8 位移位寄存器
|
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