Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 676
Encapsulation parameters/Encapsulation: BGA-676
External dimensions/packaging: BGA-676
Physical parameters/operating temperature: -40℃ ~ 100℃
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC6SLX75-L1FG676C
|
Xilinx | 完全替代 | BGA-676 |
Field Programmable Gate Array, 5831 CLBs, 74637-Cell, CMOS, PBGA676, 27 X 27MM, 1MM PITCH, FBGA-676
|
||
XC6SLX75-L1FGG676C
|
Xilinx | 完全替代 | BGA-676 |
FPGA Spartan®-6 LX Family 74637 Cells 45nm (CMOS) Technology 1V 676Pin FBGA
|
||
XC6SLX75-L1FGG676I
|
Xilinx | 完全替代 | BGA-676 |
Field Programmable Gate Array, 5831 CLBs, 74637-Cell, CMOS, PBGA676, 27 X 27MM, 1MM PITCH, LEAD FREE, FBGA-676
|
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