Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LBGA
External dimensions/packaging: LBGA
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AM29LV640DU90RPCI
|
Spansion | 功能相似 | LBGA |
Flash, 4MX16, 90ns, PBGA64, 13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64
|
||
|
|
Cypress Semiconductor | 功能相似 | BGA-64 |
IC FLASH MEM 64Mbit 64BGA
|
||
|
|
Spansion | 功能相似 | LBGA |
IC FLASH MEM 64Mbit 64BGA
|
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