Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: CDIP-28
External dimensions/length: 37.2 mm
External dimensions/width: 15.24 mm
External dimensions/height: 1.65 mm
External dimensions/packaging: CDIP-28
External dimensions/thickness: 1.65 mm
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: 3A001
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT71256S100DB
|
Integrated Device Technology | 功能相似 | CDIP |
CMOS静态RAM 256K ( 32K ×8位) CMOS STATIC RAM 256K (32K x 8-BIT)
|
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