Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-14
External dimensions/packaging: TSSOP-14
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Rail
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC74LVXT4066DTR2
|
ON Semiconductor | 功能相似 | TSSOP-14 |
四路模拟开关/多路复用器/多路解复用器 Quad Analog Switch/Multiplexer/Demultiplexer
|
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