Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LFBGA
External dimensions/packaging: LFBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Diodes | 功能相似 | 96 |
Registered Buffer Single 25CH CMOS 96Pin LFBGA T/R
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