Technical parameters/digits: 14
Technical parameters/dissipated power: 245 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 36
Encapsulation parameters/Encapsulation: SSOP-36
External dimensions/height: 2.64 mm
External dimensions/packaging: SSOP-36
Other/Packaging Methods: Tape
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review