Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: VFBGA
External dimensions/packaging: VFBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
FAN5362UC29X
|
ON Semiconductor | 功能相似 | WLCSP-6 |
Fairchild Semiconductor ### 非隔离直流/直流转换器,Fairchild Semiconductor
|
||
FAN5362UC33X
|
ON Semiconductor | 功能相似 | WLCSP-6 |
Fairchild Semiconductor ### 非隔离直流/直流转换器,Fairchild Semiconductor
|
||
TPS62672YFDR
|
TI | 功能相似 | BGA |
500mA、6MHz 高效降压转换器,Vout=1.5V 6-DSBGA -40 to 85
|
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