Technical parameters/number of pins: 4
Technical parameters/forward current: 1 A
Technical parameters/forward voltage (Max): 1.1 V
Technical parameters/operating temperature (Max): 150 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 4
Encapsulation parameters/Encapsulation: SMD
External dimensions/packaging: SMD
Other/Packaging Methods: Cut Tape (CT)
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ABS2
|
Multicomp | 功能相似 | SMD |
桥式整流器 1.0 Amp 200 Volt 30 Amp IFSM
|
||
ABS2
|
Diotec Semiconductor | 功能相似 | ABS |
桥式整流器 1.0 Amp 200 Volt 30 Amp IFSM
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review