Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS90CR214MTD/NOPB
|
TI | 功能相似 | TFSOP-48 |
LVDS 0.45V 48Pin TSSOP
|
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