Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: DBS
External dimensions/width: 6.5 mm
External dimensions/packaging: DBS
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Taiwan Semiconductor | 功能相似 | DB |
Diode Rectifier Bridge Single 400V 1.5A 4Pin Case DB
|
||
DB154G
|
GeneSiC Semiconductor | 功能相似 | EDIP-4 |
Diode Rectifier Bridge Single 400V 1.5A 4Pin Case DB
|
||
HDBL154G
|
Taiwan Semiconductor | 功能相似 |
400V 1.5A
|
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