Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 32
Encapsulation parameters/Encapsulation: QCCJ
External dimensions/length: 14.0462 mm
External dimensions/width: 11.5062 mm
External dimensions/packaging: QCCJ
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SST27SF512-70-3C-NH
|
Silicon Storage Tech | 功能相似 | QCCJ |
Many-time programmable flash
|
||
W27C512P-70
|
Winbond Electronics | 功能相似 | QCCJ |
EEPROM Parallel 512Kbit 64K x 8 5V 32Pin PLCC
|
||
W27E512P-70
|
Winbond Electronics | 功能相似 | QCCJ |
EEPROM Parallel 512Kbit 64K x 8 5V 32Pin PLCC
|
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