Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: CDIP
External dimensions/height: 3.56 mm
External dimensions/packaging: CDIP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
5962-8515522RA
|
TI | 完全替代 | DIP |
高性能Impact -X é PAL电路 HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS
|
||
TIBPAL16R4-7CN
|
TI | 完全替代 | PDIP |
高性能Impact -X é PAL电路 HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS
|
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