Encapsulation parameters/installation method: Surface Mount
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
STTS2002B2DN3F
|
ST Microelectronics | 功能相似 | TDFN-8 |
2.3 V内存模块温度传感器有2 KB的EEPROM SPD 2.3 V memory module temperature sensor with a 2 Kb SPD EEPROM
|
||
STTS2002B2DN3F
|
ST Microelectronics | 功能相似 | TDFN-8 |
2.3 V内存模块温度传感器有2 KB的EEPROM SPD 2.3 V memory module temperature sensor with a 2 Kb SPD EEPROM
|
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