Technical parameters/polarity: Male
Encapsulation parameters/installation method: Solder
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
67997-404HLF
|
FCI Electronics | 完全替代 |
AMPHENOL FCI 67997-404HLF 板至板连接器, 针座, 4路, 2排
|
|||
67997-404HLF
|
Future Communications IC | 完全替代 |
AMPHENOL FCI 67997-404HLF 板至板连接器, 针座, 4路, 2排
|
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