Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 128
Encapsulation parameters/Encapsulation: TQFP-128
External dimensions/length: 20 mm
External dimensions/width: 14 mm
External dimensions/height: 1.4 mm
External dimensions/packaging: TQFP-128
External dimensions/thickness: 1.40 mm
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
72V36100L15PFI
|
Integrated Device Technology | 类似代替 | TQFP-128 |
FIFO Mem Sync Dual Depth/Width Uni-Dir 64K x 36 128Pin TQFP
|
||
|
|
Integrated Device Technology | 功能相似 | LQFP-128 |
IC FIFO 64X36 6NS 128QFP
|
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