Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: CDIP
External dimensions/length: 32.5 mm
External dimensions/width: 7.62 mm
External dimensions/packaging: CDIP
External dimensions/thickness: 3.56 mm
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: 3A001
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY6116A-35DMB
|
Cypress Semiconductor | 功能相似 | CDIP |
2K ×8静态RAM 2K x 8 Static RAM
|
||
CY7C128A-45DMB
|
Cypress Semiconductor | 功能相似 | CDIP |
2K ×8静态RAM 2K x 8 Static RAM
|
||
|
|
Integrated Device Technology | 功能相似 | DIP |
Standard SRAM, 2KX8, 19ns, CMOS, PDIP24, 0.3INCH, PLASTIC, DIP-24
|
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