Technical parameters/memory capacity: 2000 B
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SO
External dimensions/packaging: SO
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M93C56-WMN3TP/S
|
ST Microelectronics | 类似代替 | SOP |
16千位,千位8 , 4千位,千位2和1千位( 8位或16位宽) MICROWIRE㈢串行EEPROM的访问 16 Kbit, 8 Kbit, 4 Kbit, 2 Kbit and 1 Kbit (8-bit or 16-bit wide) MICROWIRE㈢ serial access EEPROM
|
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M93C56-WMN6P
|
ST Microelectronics | 功能相似 | SOIC-8 |
STMICROELECTRONICS M93C56-WMN6P EEPROM, 微型导线, 2 Kbit, 256K x 8位 / 128K x 16位, 2 MHz, 串行微丝, SOIC, 8 引脚
|
||
M93C56-WMN6T
|
ST Microelectronics | 类似代替 | SOIC-8 |
16Kbit的, 8Kbit , 4k位, 2Kbit和的1K位( 8位或16位宽) MICROWIRE串行EEPROM的访问 16Kbit, 8Kbit, 4Kbit, 2Kbit and 1Kbit (8-bit or 16-bit wide) MICROWIRE Serial Access EEPROM
|
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