Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 208
Encapsulation parameters/Encapsulation: BFQFP-208
External dimensions/packaging: BFQFP-208
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC2C512-7PQG208C
|
Xilinx | 功能相似 | BFQFP-208 |
XC2C512 7PQG208C 磨码
|
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