Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
ST Microelectronics | 功能相似 | DIP |
IF放大器,解调器和AFC IF AMPLIFIER WITH DEMODULATOR AND AFC
|
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