Technical parameters/output current: ≤50 mA
Technical parameters/gain bandwidth product: 2.18 MHz
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/Common Mode Rejection Ratio (Min): 70 dB
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: DFP
External dimensions/packaging: DFP
Physical parameters/operating temperature: -55℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLC2274MWB
|
TI | 完全替代 | CFPAK |
高级LinCMOS轨到轨运算放大器 Advanced LinCMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS
|
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