Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A3966SLB-T
|
Allegro MicroSystems | 完全替代 | PowerSOIC-16 |
Dual Full Bridge Motor Driver 16Pin SOIC W Tube
|
||
A3966SLBTR
|
Allegro MicroSystems | 完全替代 | SOIC-16 |
Dual Full Bridge PWM Motor Driver 16Pin SOIC W T/R
|
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