Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 80
Encapsulation parameters/Encapsulation: TVSOP
External dimensions/length: 17.0 mm
External dimensions/width: 6.10 mm
External dimensions/packaging: TVSOP
External dimensions/thickness: 1.00 mm
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74ALVCHS162830DFG8
|
Integrated Device Technology | 类似代替 | TVSOP |
3.3V CMOS 1Bit to 2Bit Address Driver with 3-State Outputs and Bus-Hold
|
||
IDT74ALVCHS162830DFG8
|
Integrated Device Technology | 功能相似 | TFSOP-80 |
3.3V CMOS 1Bit to 2Bit Address Driver with 3-State Outputs and Bus-Hold
|
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