Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74HCT157D
|
NXP | 完全替代 | SOIC |
NXP 74HCT157D 芯片, 74HCT CMOS逻辑器件
|
||
74HCT157D
|
Philips | 完全替代 | SOIC-16 |
NXP 74HCT157D 芯片, 74HCT CMOS逻辑器件
|
||
74HCT157N,652
|
NXP | 完全替代 | DIP-16 |
Multiplexer 1Element CMOS 8IN 16Pin PDIP Bulk
|
||
MM74HCT157N
|
TI | 功能相似 | DIP |
QUAD 2INPUT MULTIPLEXER
|
||
SN74HCT157N
|
National Semiconductor | 功能相似 | PDIP |
TEXAS INSTRUMENTS SN74HCT157N 逻辑芯片, 四路2:1数据选择器/复用器, 16DIP
|
||
SN74HCT157N
|
TI | 功能相似 | DIP-16 |
TEXAS INSTRUMENTS SN74HCT157N 逻辑芯片, 四路2:1数据选择器/复用器, 16DIP
|
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