Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Rail
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Rochester | 功能相似 | TSSOP |
IC INVERTER 8INPUT 20TSSOP
|
||
74VHCT540AMTCX
|
ON Semiconductor | 功能相似 | TSSOP-20 |
IC INVERTER 8INPUT 20TSSOP
|
||
TC74VHCT540AFT
|
Toshiba | 功能相似 | TSSOP |
IC INVERTER 8INPUT 20TSSOP
|
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