Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX6383XR22D3+
|
Maxim Integrated | 功能相似 | TSSOP |
Processor Supervisor 2.19V 1.8V to 5V 3Pin SC-70
|
||
MAX6383XR22D3-T
|
Maxim Integrated | 功能相似 | SC-70-3 |
SC70单/双路低电压低功耗&# 181.P复位电路 SC70 Single/Dual Low-Voltage Low-Power µ.P Reset Circuits
|
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