Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: CDIP
External dimensions/packaging: CDIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A001
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Integrated Device Technology | 功能相似 | CDIP-28 |
SRAM Chip Async Single 5V 64Kbit 8K x 8 85ns 28Pin CDIP Tube
|
||
7164L100DB
|
Integrated Device Technology | 功能相似 | CDIP |
SRAM Chip Async Single 5V 64Kbit 8K x 8 100ns 28Pin CDIP Tube
|
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