Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: FBGA
External dimensions/packaging: FBGA
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
GSI | 功能相似 | FBGA |
SRAM Chip Sync Quad 1.8V/2.5V 36M-Bit 1M x 36 5.5ns/3ns 165Pin FBGA
|
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