Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SO
External dimensions/packaging: SO
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TISP7290F3DR-S
|
Bourns J.W. Miller | 功能相似 | SOIC-8 |
MEDIUM & HIGH- VOLTAGE TRIPLE元的双向晶闸管过电压保护 MEDIUM & HIGH-VOLTAGE TRIPLE ELEMENT BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
|
||
TISP7290F3SL
|
Bourns J.W. Miller | 功能相似 | SIP-3 |
MEDIUM & HIGH- VOLTAGE TRIPLE元的双向晶闸管过电压保护 MEDIUM & HIGH-VOLTAGE TRIPLE ELEMENT BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
|
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