Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: SMB
External dimensions/packaging: SMB
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TISP4080M3BJR-S
|
Bourns J.W. Miller | 功能相似 | DO-214AA-2 |
双向晶闸管过电压保护 BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review