Technical parameters/power supply voltage (DC): 3.30 V, 3.60 V (max)
Technical parameters/access time: 10.0 ns
Technical parameters/memory capacity: 2000000 B
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 44
Encapsulation parameters/Encapsulation: TSOP
External dimensions/packaging: TSOP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IS61LV12816L-10TL
|
Integrated Silicon Solution | 功能相似 | TSOP-44 |
INTEGRATED SILICON SOLUTION (ISSI) IS61LV12816L-10TL 芯片, SRAM, 高速异步型 128K x 16
|
||
IS61LV12816L-10TL-TR
|
Integrated Silicon Solution | 功能相似 | TSOP-44 |
2Mb, High-Speed, Async, 128K x 16, 10ns, 3.3V, 44Pin Tsop Ii, Lea
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review