Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: Metal
External dimensions/packaging: Metal
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HS2-3530ARH-Q
|
Intersil | 功能相似 | BCY |
抗辐射可编程的低功耗运算放大器 Radiation Hardened Programmable Low Power Op Amp
|
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