Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Samsung | 功能相似 | DIP |
DTMF Signaling Circuit, CMOS, PDIP18, 0.3INCH, DIP-18
|
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