Technical parameters/number of contacts: 31
Technical parameters/rated current: 3 A
Technical parameters/number of rows: 2
Encapsulation parameters/installation method: Through Hole
External dimensions/height: 7.87 mm
Physical parameters/contact material: Copper Alloy
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
ITT Cannon | 类似代替 | Through Hole |
Conn Micro D-Subminiature PIN 31POS Solder RA Thru-Hole 31 Terminal 1Port
|
||
MDM-31PCBRP-A174
|
ITT Corporation | 类似代替 | Through Hole |
Conn Micro D-Subminiature PIN 31POS Solder RA Thru-Hole 31 Terminal 1Port
|
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