Technical parameters/number of contacts: 9
Technical parameters/rated current: 3 A
Technical parameters/number of rows: 2
Technical parameters/number of pins: 9
Encapsulation parameters/installation method: Through Hole
External dimensions/height: 7.87 mm
Physical parameters/contact material: Copper Alloy
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MDM-9PCBRM7-F222
|
ITT Cannon | 类似代替 | Through Hole |
Conn D-Subminiature PIN 9POS 2.54mm Solder RA Thru-Hole 9 Terminal 1Port
|
||
MDM-9PCBRP
|
ITT Corporation | 类似代替 | Through Hole |
微-D印刷电路板 - .050触点间距 Micro-D PCB - .050 Contact Spacing
|
||
MDM-9PCBRP
|
ITT Cannon | 类似代替 | Through Hole |
微-D印刷电路板 - .050触点间距 Micro-D PCB - .050 Contact Spacing
|
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