Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 52
Encapsulation parameters/Encapsulation: LQFP
External dimensions/packaging: LQFP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
873991AYLFT
|
Integrated Device Technology | 功能相似 | TQFP-52 |
IC CLK GEN LV LVPECL 52-LQFP
|
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