Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 132
Encapsulation parameters/Encapsulation: BQFP
External dimensions/packaging: BQFP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Integrated Device Technology | 功能相似 | BQFP-132 |
先进先出 1K x 36 Sync先进先出, 5.0V
|
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