Technical parameters/power supply voltage: 0.95V ~ 1.05V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 1759
Encapsulation parameters/Encapsulation: BBGA-1760
External dimensions/packaging: BBGA-1760
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: 3A001A7A
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Xilinx | 完全替代 | BBGA-1760 |
Ic Fpga 720 i/o 1759fcbga
|
||
XC6VLX365T-2FF1759I
|
Xilinx | 完全替代 | BBGA-1760 |
FPGA Virtex®-6 LXT Family 364032 Cells 40nm (CMOS) Technology 1V 1759Pin FCBGA
|
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