Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
JM38510/30106BEA
|
TI | 完全替代 | CDIP |
HEX路/四路D型触发器与Clear HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
|
||
SNJ54LS174J
|
TI | 完全替代 | CDIP |
HEX路/四路D型触发器与Clear HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
|
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