Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 6
Encapsulation parameters/Encapsulation: LSSOP
External dimensions/packaging: LSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Cut Tape (CT)
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Maxim Integrated | 功能相似 | SOT-23-6 |
-100V , SOT23 / TDFN封装,简单被囚热插拔控制器 -100V, SOT23/TDFN, Simple Swapper Hot-Swap Controllers
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