Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 100
Encapsulation parameters/Encapsulation: LQFP
External dimensions/packaging: LQFP
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IS61NVF51236-6.5TQ
|
Integrated Silicon Solution | 功能相似 | LQFP |
SRAM Chip Sync Quad 2.5V 18M-Bit 512K x 36 6.5ns 100Pin TQFP
|
||
IS61NVF51236-6.5TQL
|
Integrated Silicon Solution | 功能相似 | TQFP-100 |
SRAM Chip Sync Quad 2.5V 18M-bit 512K x 36 6.5ns 100Pin TQFP
|
||
VF5
|
Integrated Silicon Solution | 功能相似 | LQFP |
ZBT SRAM, 512KX36, 6.5ns, CMOS, PQFP100, LEAD FREE, TQFP-100
|
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