Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: DFN
External dimensions/packaging: DFN
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LT3463AEDD#PBF
|
ADI | 功能相似 | DFN |
LINEAR TECHNOLOGY LT3463AEDD#PBF 芯片, 直流/直流转换器, 双输出, 升压, 10DFN
|
||
LT3463AEDD#PBF
|
Linear Technology | 功能相似 | DFN-10 |
LINEAR TECHNOLOGY LT3463AEDD#PBF 芯片, 直流/直流转换器, 双输出, 升压, 10DFN
|
||
LT3463AEDD#TRPBF
|
ADI | 功能相似 | DFN |
Boost, Charge Pump Switching Regulator IC Positive and Negative (Dual Rail) Adjustable ±1.25V 2 Output 180mA (Switch), 320mA (Switch) 10-WFDFN Exposed Pad
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