Technical parameters/resistance: 4.70 kΩ
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 9
Other/Product Lifecycle: Active
Other/Packaging Methods: Bag
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
L091S472LF
|
TT Electronics/BI | 功能相似 |
Res Thick Film NET 4.7KΩ 2% 0.9W 100ppm/℃ BUS Conformal 9Pin SIP Pin Thru-Hole Bulk
|
|||
L091S472LF
|
TT Electronics/IRC | 功能相似 | SIP |
Res Thick Film NET 4.7KΩ 2% 0.9W 100ppm/℃ BUS Conformal 9Pin SIP Pin Thru-Hole Bulk
|
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