Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-14
External dimensions/packaging: TSSOP-14
Other/Product Lifecycle: Supply in progress
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN74AHC00-Q1
|
TI | 功能相似 |
汽车类四路 2 输入正与非门
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review